Ceramic chips consist of formulated ceramic dielectric materials which have been fabricated into thin layers, interspersed with metal electrodes alternately exposed on opposite edges of the laminated structure. The entire structure is then fired at high temperature to produce a monolithic block which provides high capacitance values in a small physical volume. After firing, conductive terminations are applied to opposite ends of the chip to make contact with the exposed electrodes. Standard end terminations use a nickel barrier layer and a tin overplate to provide excellent solderability for the customer.
MLCC( Chip Capacitors)
sizes 01005, 0201, 0402, 0603, 0805, 1206, 1210, 1808, 1812, 1825, 2225